Semiconductors

Your benefits

Sophisticated technology for semiconductor production

Ultimate accuracy is the backbone of semiconductor and wafer production. With its technically mature sealing systems, GAT meets the demands implied in the transmission of rotary motion into a vacuum.

Highest precision for chemical mechanical polishing (CMP)

One of the most important and critical processes in the production of semiconductor hard disks and LED wafers is chemical-mechanical polishing or planarization (CMP).
In chemical-mechanical polishing or planarization, extremely smooth and flat material surfaces are achieved in wafer production through a combination of chemical and abrasive effects, which are primarily required to ensure the functionality of the connections present in the structure of the printed circuit boards.
The use of our equipment ensures a reliable polishing process and safe handling of the wafers/conductor boards. In addition, the conditioning of the polishing pad after the planarization process is controlled by our equipment.

Application-specific combinations

Rotary unions from GAT are tailored to your requirements and the specifications of your application. The modular design allows the combination of any features required, including electrical slip rings.